Featured Product : T-GLOBAL TG-N8000 Non-Silicone Thermal Putty
The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.
TG-N8000’s consistency makes it ideal for interfaces with poor surface finishes, high tolerances and multiple heat sources.
Available in syringes and pails for easy dispensing and high volume production.
Silicone free thermal gel
Lower contact thermal impedance than thermal pads
Physical property in between liquid and solid state
Gap fillers for uneven or irregular surfaces of heat sources and heat sink
Applicable for dispenser
Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.