The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.

TG-N8000’s consistency makes it ideal for interfaces with poor surface finishes, high tolerances and multiple heat sources.

Available in syringes and pails for easy dispensing and high volume production.


  • Silicone free thermal gel
  • Lower contact thermal impedance than thermal pads
  • Physical property in between liquid and solid state
  • Gap fillers for uneven or irregular surfaces of heat sources and heat sink
  • Applicable for dispenser


  • Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.


  • Thermal Conductivity: 8.0 W/m•K
  • Color: Yellow
  • Viscosity: 430Pa·s ±100
  • Density: 3 g/cm³ ±0.15
  • Volume Resistivity: >10¹⁰ Ohm-m
  • Operating Temperature: -40~+125 ° C
  • Standard Package: Tube/ Pot