New Product Launch: TG-ASD50AB Thermal Gel

Introducing TG-ASD50AB Thermal Gel, a next-generation, two-part, silicone-based thermal interface material engineered for high-performance electronics. This ultra-flexible, high-elasticity gel is designed to deliver superior thermal management and mechanical resilience across a wide range of demanding applications.

Building on the success of the TG-ASD35AB Thermal Gel, the new TG-ASD50AB offers enhanced thermal conductivity of 5.0 W/mK – an ideal solution for environments requiring both thermal efficiency and mechanical durability.

TG-ASD50AB cures at room temperature within 2-4 hours (depending on application thickness), and can be heat-cured in just 20-40 minutes at 80℃, supporting faster production cycles. Its high elasticity ensures the gel conforms tightly to heat-generating components, minimizing mechanical stress and ensuring consistent surface contact – even under pressure, vibration, or thermal cycling. Once pressure is released, the gel quickly returns to its original shape without hardening or deforming, maintaining stable long-term performance.

Specifically developed to enhance the reliability of electronic systems in automotive applications, TG-ASD50AB addresses the growing heat management needs of systems such as Engine Control Units (ECUs), Battery Management Systems (BMS), and power electronics modules. As these components face increasing computational loads, effective thermal management becomes critical to ensure consistent performance and long-term reliability.

The gel is highly tolerant of thermal expansion and contraction, and remains stable in high-vibration environments, making it ideal for use in extreme conditions and harsh environments where performance cannot be compromised.

In addition, TG-ASD50AB supports automated dispensing and offers excellent rheological properties, streamlining production workflows, enhancing manufacturing efficiency, and reducing assembly costs – meeting the stringent demands of the automotive electronics industry.

For ease of application, TG-ASD50AB is available in both pots and pails.

Product overview:

  • Thermal conductivity: 5.0 W/mK
  • Low thermal impedance
  • High elasticity
  • Two parts
  • Fast curing
  • Suitable for volume manufacturing
  • Easily dispensed